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Microscope Optics

Microscope optics for PI640 and XI400

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Optris Microscope Optics

Advanced Thermal Inspection for Electronic Components

The Optris Microscope Optics are specially designed for the thermal inspection of electronic boards and the analysis of small chip-level components. With a resolution down to 28 μm, this lens provides unparalleled precision for inspecting microelectronics.

Key Features

  • High-Quality Microscope Lenses: Designed for thermal inspection of electronic boards and small components.

  • Resolution: Capable of detecting details as small as 28 μm, ideal for chip-level analysis.

  • Variable Working Distance: The distance between the measurement object and the camera can range from 80 to 100 mm, offering flexibility for various applications.

  • Compatibility: Suitable for use with Optris PI and Xi series thermal cameras.

  • Non-Contact Temperature Measurement: Enables contactless temperature measurements of miniature electronic components.

Applications

  • PCB Quality Control: Provides detailed inspection of solder joints and traces.

  • Failure Analysis: Aids in identifying defects and thermal issues in microelectronics.

  • Thermal Design Optimization: Offers insights into thermal performance and hotspots on PCBs.

  • Research and Development: Supports scientific research into the thermal behavior of electronic components.

Benefits

  1. Accurate Thermal Analysis: Delivers detailed thermal images of small components, crucial for defect detection.

  2. Easy Integration: Simple to use with Optris thermal cameras for a complete inspection solution.

  3. Flexible Working Distance: The adjustable distance allows effective inspection of various components.

  4. Durable Design: Engineered for long-term use in demanding environments.

Technical Specifications

  • Resolution: Down to 28 μm

  • Working Distance: 80 – 100 mm

  • Compatibility: Optris PI and Xi series thermal cameras

  • Application Area: Thermal inspection of electronic components

The Optris Microscope Optics are the ideal solution for professionals needing detailed thermal analyses of microelectronics. With their high resolution and ease of use, they provide a powerful tool for quality control, failure analysis, and thermal design. For more information or to request a quote, please contact us!

Technical specifications

Thermal imaging camera: PI640 and XI400

PI640: 28 μm, 12° x 9° (F=1.1) / f= 44 mm

XI400: 90 μm, 18° x 14° (f = 20 mm)

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